Heat Dissipation Substrate

This substrate features high strength and heat dissipation, achieved by increasing the thermal conductivity of silicon nitride, a material commonly used in structural components, to 90 W/m·K. It is used in power semiconductor modules, inverters, converters, and other applications.

Silicon nitride ceramics are tough and have a large degree of flexibility, so they can maintain their insulating properties without cracking even if the components they are joined to are slightly deformed. Furthermore, insulated circuit boards, in which copper plates are bonded to a silicon nitride substrate via an activated metal brazing material to form a circuit, can form copper circuits with thicknesses ranging from 0.1 mm to a maximum of 0.8 mm because of the high strength of the ceramic substrate.