Wafer Chuck
Overview
These are high-precision components used to fix silicon wafers, which form the base material, in the semiconductor manufacturing process. Ceramics, which offer excellent wear resistance and corrosion resistance in harsh environments, are used in their production.
Our products include "vacuum chucks (pin chucks/porous chucks)" that can adjust the chuck shape according to the wafer shape, achieving a flatness of 0.2 μm or less for 12-inch wafers, as well as "electrostatic chucks" that use electrostatic force to attract silicon wafers while maintaining a uniform surface temperature. We develop products tailored to our customers' requirements and provide them from the prototyping stage.
Product Introduction Video
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Related Products
Wafer chucks with metal electrodes embedded in ceramics and co-sintered into a single body. Lamination technology and heater design enable excellent temperature uniformity.
Wafer chucks with a porous body and base integrated into a single structure, offering excellent flatness and uniform suction force.